Rework PCB — precise repair and component replacement per IPC 7711/7721
Rework is the process of repairing or modifying an assembled PCB: replacing damaged or faulty components, correcting soldering defects, removing and re-soldering BGA packages. We carry out rework as per the IPC 7711/7721 standard — with full documentation of every repair and quality verification after the process.
Request a quote →What is PCB rework and when is it needed?
Rework is the repair or modification of a PCB after assembly — as opposed to production from scratch. The need for rework arises in several situations: a component defect detected after a functional test, an assembly error requiring correction, a design change requiring component replacement (ECO), or repair of a device returned from service.
Unlike series assembly on the line, rework requires precise, controlled, point intervention — removing one component without damaging neighbouring elements and the board, then re-mounting it with the same solder joint quality as in factory assembly.
The IPC 7711/7721 standard defines the permissible methods, thermal parameters and acceptance criteria for rework — it is what distinguishes professional repair from a makeshift soldering iron intervention.
Soldering and rework methods at Siltegro
BGA replacement
Removing and re-mounting BGA (Ball Grid Array) components — a process requiring controlled heating, removal of old solder balls, preparation of the solder field and precise placement of the new component. Joint quality verified by X-Ray inspection after rework.
SMD soldering
Manual and selective soldering of surface-mount components during rework — replacing resistors, capacitors, QFN chips and other SMD components without damaging neighbouring solder fields.
THT soldering
Replacement of through-hole components during rework: connectors, transformers, power elements. Precise desoldering without overheating the laminate and neighbouring traces.
Automatic soldering for series repairs
For rework covering a larger number of identical boards — e.g. correcting an error detected across a whole batch — we use automated soldering stations ensuring repeatability of the correction regardless of the number of units.
Repair of assembly defects
Correction of solder bridges, cold joints and component misalignment detected during AOI or X-Ray inspection — repair without restarting the whole batch.
When is rework the right solution?
Defect detected after a functional test
If a single board or batch fails a test because of one faulty component — rework lets you fix the problem without scrapping the whole board.
Design change requiring component replacement (ECO)
When the project documentation changes after production starts — rework implements the change on already-assembled boards instead of waiting for a new series.
Pilot batch update after field tests
If the first production batch passed internal or target-condition tests but needs a correction before the full series launch — rework lets you implement the change for the existing batch without repeating the entire assembly.
Correction detected during X-Ray or AOI inspection
When inspection reveals a problem with a specific solder joint — a point repair is faster and cheaper than re-assembly.
IPC 7711/7721 — the technical standard of rework
IPC 7711/7721 is the international standard defining the permissible repair and modification procedures for electronic assemblies. It covers, among others, the permissible thermal profiles when removing and mounting components, the joint quality acceptance criteria after rework, and the requirements for PCB surface preparation after component removal.
Carrying out rework as per IPC 7711/7721 means that every repair is documented, repeatable and verifiable — not an ad hoc intervention, but a controlled technical process.
What sets us apart in rework PCB?
X-Ray inspection after rework
Verification of BGA joint quality after replacement using radiographic inspection — confirmation that the new joint meets the same standards as factory assembly.
Rework as a documented process
Every repair is recorded as per the Siltegro traceability system — batch number, description of the correction performed, verification result after rework.
Team with factory assembly experience
Rework is performed by operators who know the SMT and THT assembly process from the ground up — they understand not only how to repair a joint, but why the defect occurred.
Technical parameters
| Standard | IPC 7711/7721 |
| Component scope | BGA, QFN, SMD, THT |
| Soldering methods | Manual, selective, automatic |
| Verification after rework | X-Ray inspection, AOI, functional tests |
| Documentation | Full repair record in the traceability system |
| Contact time | 24 hours |
What to prepare for a rework request?
Problem description
Which component requires replacement or which defect was detected
Board documentation
Schematic, BOM or project number if the board was produced by Siltegro
Number of units
A single repair or a whole-batch correction
Deadline
Whether rework is urgent (return repair) or planned (ECO implementation)